Flex-Rigid
Layer number：14Layer (5R+4F+5R) Material：FR4 / R-F777 Board thickness：2.0mm Copper thickness：1OZ Finish surface：ENIG Min Line：0.09mm Min hole size：0.20mm
Product Attributes
Layer number：14Layer (5R+4F+5R)
Material：FR4 / R-F777
Board thickness：2.0mm
Copper thickness：1OZ
Finish surface：ENIG
Min Line：0.09mm
Min hole size：0.20mm
Application Area
Aerospace
Communication
Medical
Consumer
Automotive
Industrial control
Semiconductor
