Flex-Rigid
Layer number：4Layer HDI（1R+2F+1R) Material：FR4 +Flex Board thickness：0.35mm Copper thickness：1OZ Finish surface：ENIG Min Line：0.075mm Min hole size：0.10mm
Product Attributes
Layer number：4Layer HDI（1R+2F+1R)
Material：FR4 +Flex
Board thickness：0.35mm
Copper thickness：1OZ
Finish surface：ENIG
Min Line：0.075mm
Min hole size：0.10mm
Application Area
Aerospace
Communication
Medical
Consumer
Automotive
Industrial control
Semiconductor
